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Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints

This article is an evaluation of the phenomena occurring in adhesive joints during curing and their consequences. Considering changes in the values of Young’s modulus distributed along the joint thickness, and potential changes in adhesive strength in the cured state, the use of a numerical model ma...

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Detalles Bibliográficos
Autores principales: Anasiewicz, Kamil, Kuczmaszewski, Józef
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7827656/
https://www.ncbi.nlm.nih.gov/pubmed/33440638
http://dx.doi.org/10.3390/ma14020328
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author Anasiewicz, Kamil
Kuczmaszewski, Józef
author_facet Anasiewicz, Kamil
Kuczmaszewski, Józef
author_sort Anasiewicz, Kamil
collection PubMed
description This article is an evaluation of the phenomena occurring in adhesive joints during curing and their consequences. Considering changes in the values of Young’s modulus distributed along the joint thickness, and potential changes in adhesive strength in the cured state, the use of a numerical model may make it possible to improve finite element simulation effects and bring their results closer to experimental data. The results of a tensile test of a double overlap adhesive joint sample, performed using an extensometer, are presented. This test allowed for the precise determination of the shear modulus G of the cured adhesive under experimental conditions. Then, on the basis of the research carried out so far, a numerical model was built, taking the differences observed in the properties of the joint material into account. The stress distribution in a three-zone adhesive joint was analyzed in comparison to the standard numerical model in which the adhesive in the joint was treated as isotropic. It is proposed that a joint model with three-zones, differing in the Young’s modulus values, is more accurate for mapping the experimental results.
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spelling pubmed-78276562021-01-25 Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints Anasiewicz, Kamil Kuczmaszewski, Józef Materials (Basel) Article This article is an evaluation of the phenomena occurring in adhesive joints during curing and their consequences. Considering changes in the values of Young’s modulus distributed along the joint thickness, and potential changes in adhesive strength in the cured state, the use of a numerical model may make it possible to improve finite element simulation effects and bring their results closer to experimental data. The results of a tensile test of a double overlap adhesive joint sample, performed using an extensometer, are presented. This test allowed for the precise determination of the shear modulus G of the cured adhesive under experimental conditions. Then, on the basis of the research carried out so far, a numerical model was built, taking the differences observed in the properties of the joint material into account. The stress distribution in a three-zone adhesive joint was analyzed in comparison to the standard numerical model in which the adhesive in the joint was treated as isotropic. It is proposed that a joint model with three-zones, differing in the Young’s modulus values, is more accurate for mapping the experimental results. MDPI 2021-01-11 /pmc/articles/PMC7827656/ /pubmed/33440638 http://dx.doi.org/10.3390/ma14020328 Text en © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Anasiewicz, Kamil
Kuczmaszewski, Józef
Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints
title Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints
title_full Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints
title_fullStr Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints
title_full_unstemmed Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints
title_short Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints
title_sort apparent young’s modulus of the adhesive in numerical modeling of adhesive joints
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7827656/
https://www.ncbi.nlm.nih.gov/pubmed/33440638
http://dx.doi.org/10.3390/ma14020328
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