Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

[Image: see text] Improving the interface stability for nanosized thin films on brittle substrates is crucial for technological applications such as microelectronics because the so-called brittle–ductile interfaces limit their overall reliability. By tuning the thin film properties, interface adhesi...

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Detalles Bibliográficos
Autores principales: Lassnig, Alice, Terziyska, Velislava L., Zalesak, Jakub, Jörg, Tanja, Toebbens, Daniel M., Griesser, Thomas, Mitterer, Christian, Pippan, Reinhard, Cordill, Megan J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2020
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7836095/
https://www.ncbi.nlm.nih.gov/pubmed/33521588
http://dx.doi.org/10.1021/acsanm.0c02182

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7836095/
https://www.ncbi.nlm.nih.gov/pubmed/33521588
http://dx.doi.org/10.1021/acsanm.0c02182

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