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Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
[Image: see text] Improving the interface stability for nanosized thin films on brittle substrates is crucial for technological applications such as microelectronics because the so-called brittle–ductile interfaces limit their overall reliability. By tuning the thin film properties, interface adhesi...
| Autores principales: | , , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical
Society
2020
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7836095/ https://www.ncbi.nlm.nih.gov/pubmed/33521588 http://dx.doi.org/10.1021/acsanm.0c02182 |