Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type

The thermal performance of a deep UV LED package in three different chip on board (COB) substrates was studied by finite element simulation. The relationship between the temperature of each component in different COB substrates and the packaging density of the deep UV LED was analyzed. Having the sa...

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Detalles Bibliográficos
Autores principales: Xia, Zhenghao, Liang, Shenghua, Li, Bingqian, Wang, Fei, Zhang, Daming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier GmbH. 2021
Materias:
Original Research Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7843092/
https://www.ncbi.nlm.nih.gov/pubmed/33531717
http://dx.doi.org/10.1016/j.ijleo.2021.166392

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7843092/
https://www.ncbi.nlm.nih.gov/pubmed/33531717
http://dx.doi.org/10.1016/j.ijleo.2021.166392

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