Cargando…
Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type
The thermal performance of a deep UV LED package in three different chip on board (COB) substrates was studied by finite element simulation. The relationship between the temperature of each component in different COB substrates and the packaging density of the deep UV LED was analyzed. Having the sa...
| Autores principales: | , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier GmbH.
2021
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7843092/ https://www.ncbi.nlm.nih.gov/pubmed/33531717 http://dx.doi.org/10.1016/j.ijleo.2021.166392 |