Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Nanocomposite Sn-Bi solders received noticeable attention for flexible electronics due to their improved mechanical properties. The main limitation is the dispersion of nanoparticles in the solder alloy. Accordingly, in this work, varying additions of ZnO nanoparticles were successfully dispersed in...

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Detalles Bibliográficos
Autores principales: Rajendran, Sri Harini, Kang, Hyejun, Jung, Jae Pil
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7875009/
https://www.ncbi.nlm.nih.gov/pubmed/33589857
http://dx.doi.org/10.1007/s11665-021-05518-5

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7875009/
https://www.ncbi.nlm.nih.gov/pubmed/33589857
http://dx.doi.org/10.1007/s11665-021-05518-5

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