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Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties
Nanocomposite Sn-Bi solders received noticeable attention for flexible electronics due to their improved mechanical properties. The main limitation is the dispersion of nanoparticles in the solder alloy. Accordingly, in this work, varying additions of ZnO nanoparticles were successfully dispersed in...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer US
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7875009/ https://www.ncbi.nlm.nih.gov/pubmed/33589857 http://dx.doi.org/10.1007/s11665-021-05518-5 |