Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

Integrating two-dimensional (2D) materials into semiconductor manufacturing lines is essential to exploit their material properties in a wide range of application areas. However, current approaches are not compatible with high-volume manufacturing on wafer level. Here, we report a generic methodolog...

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Detalles Bibliográficos
Autores principales: Quellmalz, Arne, Wang, Xiaojing, Sawallich, Simon, Uzlu, Burkay, Otto, Martin, Wagner, Stefan, Wang, Zhenxing, Prechtl, Maximilian, Hartwig, Oliver, Luo, Siwei, Duesberg, Georg S., Lemme, Max C., Gylfason, Kristinn B., Roxhed, Niclas, Stemme, Göran, Niklaus, Frank
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7876008/
https://www.ncbi.nlm.nih.gov/pubmed/33568669
http://dx.doi.org/10.1038/s41467-021-21136-0

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7876008/
https://www.ncbi.nlm.nih.gov/pubmed/33568669
http://dx.doi.org/10.1038/s41467-021-21136-0

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