Gallium-Enhanced Aluminum and Copper Electromigration Performance for Flexible Electronics

[Image: see text] Wide range binary and ternary thin film combinatorial libraries mixing Al, Cu, and Ga were screened for identifying alloys with enhanced ability to withstand electromigration. Bidimensional test wires were obtained by lithographically patterning the substrates before simultaneous v...

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Detalles Bibliográficos
Autores principales: Ravandi, Saeedeh, Minenkov, Alexey, Mardare, Cezarina Cela, Kollender, Jan Philipp, Groiss, Heiko, Hassel, Achim Walter, Mardare, Andrei Ionut
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2021
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7883345/
https://www.ncbi.nlm.nih.gov/pubmed/33492947
http://dx.doi.org/10.1021/acsami.0c22211

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7883345/
https://www.ncbi.nlm.nih.gov/pubmed/33492947
http://dx.doi.org/10.1021/acsami.0c22211

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