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Gallium-Enhanced Aluminum and Copper Electromigration Performance for Flexible Electronics
[Image: see text] Wide range binary and ternary thin film combinatorial libraries mixing Al, Cu, and Ga were screened for identifying alloys with enhanced ability to withstand electromigration. Bidimensional test wires were obtained by lithographically patterning the substrates before simultaneous v...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American
Chemical Society
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7883345/ https://www.ncbi.nlm.nih.gov/pubmed/33492947 http://dx.doi.org/10.1021/acsami.0c22211 |