The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturing as they enable 3D chip integration. Howeve...

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Detalles Bibliográficos
Autores principales: Frasca, Simone, Leghziel, Rebecca C., Arabadzhiev, Ivo N., Pasquier, Benoît, Tomassi, Grégoire F. M., Carrara, Sandro, Charbon, Edoardo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7890059/
https://www.ncbi.nlm.nih.gov/pubmed/33597624
http://dx.doi.org/10.1038/s41598-021-83546-w

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7890059/
https://www.ncbi.nlm.nih.gov/pubmed/33597624
http://dx.doi.org/10.1038/s41598-021-83546-w

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