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The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias
We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturing as they enable 3D chip integration. Howeve...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7890059/ https://www.ncbi.nlm.nih.gov/pubmed/33597624 http://dx.doi.org/10.1038/s41598-021-83546-w |