Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal...

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Detalles Bibliográficos
Autores principales: Cui, Ying, Qin, Zihao, Wu, Huan, Li, Man, Hu, Yongjie
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7904764/
https://www.ncbi.nlm.nih.gov/pubmed/33627644
http://dx.doi.org/10.1038/s41467-021-21531-7

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7904764/
https://www.ncbi.nlm.nih.gov/pubmed/33627644
http://dx.doi.org/10.1038/s41467-021-21531-7

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