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Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7904764/ https://www.ncbi.nlm.nih.gov/pubmed/33627644 http://dx.doi.org/10.1038/s41467-021-21531-7 |