Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design

Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because...

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Detalles Bibliográficos
Autores principales: Kim, Woochang, Kim, Chihyun, Lee, Wonseok, Park, Jinsung, Kim, Duckjong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7909517/
https://www.ncbi.nlm.nih.gov/pubmed/33498514
http://dx.doi.org/10.3390/biom11020132

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7909517/
https://www.ncbi.nlm.nih.gov/pubmed/33498514
http://dx.doi.org/10.3390/biom11020132

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