Cargando…

Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design

Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because...

Descripción completa

Detalles Bibliográficos
Autores principales: Kim, Woochang, Kim, Chihyun, Lee, Wonseok, Park, Jinsung, Kim, Duckjong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7909517/
https://www.ncbi.nlm.nih.gov/pubmed/33498514
http://dx.doi.org/10.3390/biom11020132
_version_ 1783655946400038912
author Kim, Woochang
Kim, Chihyun
Lee, Wonseok
Park, Jinsung
Kim, Duckjong
author_facet Kim, Woochang
Kim, Chihyun
Lee, Wonseok
Park, Jinsung
Kim, Duckjong
author_sort Kim, Woochang
collection PubMed
description Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future.
format Online
Article
Text
id pubmed-7909517
institution National Center for Biotechnology Information
language English
publishDate 2021
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-79095172021-02-27 Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design Kim, Woochang Kim, Chihyun Lee, Wonseok Park, Jinsung Kim, Duckjong Biomolecules Article Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future. MDPI 2021-01-20 /pmc/articles/PMC7909517/ /pubmed/33498514 http://dx.doi.org/10.3390/biom11020132 Text en © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Kim, Woochang
Kim, Chihyun
Lee, Wonseok
Park, Jinsung
Kim, Duckjong
Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
title Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
title_full Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
title_fullStr Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
title_full_unstemmed Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
title_short Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
title_sort innocuous, highly conductive, and affordable thermal interface material with copper-based multi-dimensional filler design
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7909517/
https://www.ncbi.nlm.nih.gov/pubmed/33498514
http://dx.doi.org/10.3390/biom11020132
work_keys_str_mv AT kimwoochang innocuoushighlyconductiveandaffordablethermalinterfacematerialwithcopperbasedmultidimensionalfillerdesign
AT kimchihyun innocuoushighlyconductiveandaffordablethermalinterfacematerialwithcopperbasedmultidimensionalfillerdesign
AT leewonseok innocuoushighlyconductiveandaffordablethermalinterfacematerialwithcopperbasedmultidimensionalfillerdesign
AT parkjinsung innocuoushighlyconductiveandaffordablethermalinterfacematerialwithcopperbasedmultidimensionalfillerdesign
AT kimduckjong innocuoushighlyconductiveandaffordablethermalinterfacematerialwithcopperbasedmultidimensionalfillerdesign