Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu(6)Sn(5) growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisk...

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Detalles Bibliográficos
Autores principales: Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Ramli, Muhammad Mahyiddin, Yee, Khor Chu, Mohd Mokhtar, Noor Zaimah, Chaiprapa, Jitrin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7914571/
https://www.ncbi.nlm.nih.gov/pubmed/33562471
http://dx.doi.org/10.3390/ma14040738

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7914571/
https://www.ncbi.nlm.nih.gov/pubmed/33562471
http://dx.doi.org/10.3390/ma14040738

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