A RF Redundant TSV Interconnection for High Resistance Si Interposer

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio fre...

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Detalles Bibliográficos
Autores principales: Wang, Mengcheng, Ma, Shenglin, Jin, Yufeng, Wang, Wei, Chen, Jing, Hu, Liulin, He, Shuwei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7914721/
https://www.ncbi.nlm.nih.gov/pubmed/33567782
http://dx.doi.org/10.3390/mi12020169

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7914721/
https://www.ncbi.nlm.nih.gov/pubmed/33567782
http://dx.doi.org/10.3390/mi12020169

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