Cargando…
Effect of load sequence interaction on bond-wire lifetime due to power cycling
Experimental investigations on the effects of load sequence on degradations of bond-wire contacts of Insulated Gate Bipolar Transistors power modules are reported in this paper. Both the junction temperature swing ([Formula: see text] ) and the heating duration ([Formula: see text] ) are investigate...
Autores principales: | Khatir, Zoubir, Tran, Son-Ha, Ibrahim, Ali, Lallemand, Richard, Degrenne, Nicolas |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2021
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7946878/ https://www.ncbi.nlm.nih.gov/pubmed/33692407 http://dx.doi.org/10.1038/s41598-021-84976-2 |
Ejemplares similares
-
Thermal Fatigue Effect on the Grain Groove Profile in the Case of Diffusion in Thin Polycrystalline Films of Power Electronic Devices
por: Hamieh, Tayssir, et al.
Publicado: (2023) -
New solution of the partial differential equation of the grain groove profile problem in the case of evaporation/condensation
por: Hamieh, Tayssir, et al.
Publicado: (2019) -
Bond Wire Fatigue of Au, Cu, and PCC in Power LED Packages †
por: Czerny, Bernhard, et al.
Publicado: (2023) -
Wire bonding in microelectronics
por: Harman, George G
Publicado: (2010) -
Copper wire bonding
por: Chauhan, Preeti S, et al.
Publicado: (2014)