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Low-Resistance Room-Temperature Interconnection Technique for Bonding Fine Pitch Bumps
In this work, we demonstrate on a new interconnection technology which can be used for bonding Flip-Chips with 5-µm-Bumps and fine pitches <5 µm. In this technology, the bumps on both joint partners are coated with metallic nanowires (in most cases copper, in rare cases gold), through an in situ...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer US
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7985230/ https://www.ncbi.nlm.nih.gov/pubmed/33776387 http://dx.doi.org/10.1007/s11665-021-05649-9 |