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Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent charac...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7998557/ https://www.ncbi.nlm.nih.gov/pubmed/33802243 http://dx.doi.org/10.3390/mi12030295 |