Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties

In this paper, we first report the laser grinding method for a single-crystal silicon wafer machined by diamond sawing. 3D laser scanning confocal microscope (LSCM), X-ray diffraction (XRD), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS), laser micro-Raman spectroscopy we...

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Detalles Bibliográficos
Autores principales: Li, Xinxin, Wang, Yimeng, Guan, Yingchun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8000081/
https://www.ncbi.nlm.nih.gov/pubmed/33806337
http://dx.doi.org/10.3390/mi12030262

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8000081/
https://www.ncbi.nlm.nih.gov/pubmed/33806337
http://dx.doi.org/10.3390/mi12030262

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