Cargando…
Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties
In this paper, we first report the laser grinding method for a single-crystal silicon wafer machined by diamond sawing. 3D laser scanning confocal microscope (LSCM), X-ray diffraction (XRD), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS), laser micro-Raman spectroscopy we...
| Autores principales: | , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8000081/ https://www.ncbi.nlm.nih.gov/pubmed/33806337 http://dx.doi.org/10.3390/mi12030262 |