Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor

Thermal stress is one of the main sources of micro-electro-mechanical systems (MEMS) devices error. The Wheatstone bridge is the sensing structure of a typical piezoresistive MEMS pressure sensor. In this study, the thermal stress induced by potting adhesive in MEMS pressure sensor was investigated...

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Detalles Bibliográficos
Autores principales: Zhang, Yunfan, Li, Bowen, Li, Hui, Shen, Shengnan, Li, Feng, Ni, Wentao, Cao, Wan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8001441/
https://www.ncbi.nlm.nih.gov/pubmed/33809139
http://dx.doi.org/10.3390/s21062011

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8001441/
https://www.ncbi.nlm.nih.gov/pubmed/33809139
http://dx.doi.org/10.3390/s21062011

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