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Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor

Thermal stress is one of the main sources of micro-electro-mechanical systems (MEMS) devices error. The Wheatstone bridge is the sensing structure of a typical piezoresistive MEMS pressure sensor. In this study, the thermal stress induced by potting adhesive in MEMS pressure sensor was investigated...

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Autores principales: Zhang, Yunfan, Li, Bowen, Li, Hui, Shen, Shengnan, Li, Feng, Ni, Wentao, Cao, Wan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8001441/
https://www.ncbi.nlm.nih.gov/pubmed/33809139
http://dx.doi.org/10.3390/s21062011
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author Zhang, Yunfan
Li, Bowen
Li, Hui
Shen, Shengnan
Li, Feng
Ni, Wentao
Cao, Wan
author_facet Zhang, Yunfan
Li, Bowen
Li, Hui
Shen, Shengnan
Li, Feng
Ni, Wentao
Cao, Wan
author_sort Zhang, Yunfan
collection PubMed
description Thermal stress is one of the main sources of micro-electro-mechanical systems (MEMS) devices error. The Wheatstone bridge is the sensing structure of a typical piezoresistive MEMS pressure sensor. In this study, the thermal stress induced by potting adhesive in MEMS pressure sensor was investigated by experiments, calculated by analytics and analyzed by simulations. An experiment system was used to test the sensor at different air pressures and temperatures. The error becomes greater with the decrease in pressure. A set of novel formulas were proposed to calculate the stress–strain on Wheatstone bridge. The error increases with the temperature deviating from 25 °C. A full-scale geometric model was developed, and finite element simulations were performed, to analyze the effect of the stress on MEMS pressure sensor induced by different temperatures and thicknesses of potting adhesive. Simulation results agree well with the experiments, which indicated that there is a 3.48% to 6.50% output error in 0.35 mm potting adhesive at 150 °C. With the thickness of potting adhesive increasing, the variations of output error of the Wheatstone bridge present an N-shaped curve. The output error meets a maximum of 5.30% in the potting adhesive of 0.95 mm and can be reduced to 2.47%, by increasing the potting adhesive to 2.40 mm.
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spelling pubmed-80014412021-03-28 Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor Zhang, Yunfan Li, Bowen Li, Hui Shen, Shengnan Li, Feng Ni, Wentao Cao, Wan Sensors (Basel) Communication Thermal stress is one of the main sources of micro-electro-mechanical systems (MEMS) devices error. The Wheatstone bridge is the sensing structure of a typical piezoresistive MEMS pressure sensor. In this study, the thermal stress induced by potting adhesive in MEMS pressure sensor was investigated by experiments, calculated by analytics and analyzed by simulations. An experiment system was used to test the sensor at different air pressures and temperatures. The error becomes greater with the decrease in pressure. A set of novel formulas were proposed to calculate the stress–strain on Wheatstone bridge. The error increases with the temperature deviating from 25 °C. A full-scale geometric model was developed, and finite element simulations were performed, to analyze the effect of the stress on MEMS pressure sensor induced by different temperatures and thicknesses of potting adhesive. Simulation results agree well with the experiments, which indicated that there is a 3.48% to 6.50% output error in 0.35 mm potting adhesive at 150 °C. With the thickness of potting adhesive increasing, the variations of output error of the Wheatstone bridge present an N-shaped curve. The output error meets a maximum of 5.30% in the potting adhesive of 0.95 mm and can be reduced to 2.47%, by increasing the potting adhesive to 2.40 mm. MDPI 2021-03-12 /pmc/articles/PMC8001441/ /pubmed/33809139 http://dx.doi.org/10.3390/s21062011 Text en © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Communication
Zhang, Yunfan
Li, Bowen
Li, Hui
Shen, Shengnan
Li, Feng
Ni, Wentao
Cao, Wan
Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor
title Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor
title_full Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor
title_fullStr Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor
title_full_unstemmed Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor
title_short Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor
title_sort investigation of potting-adhesive-induced thermal stress in mems pressure sensor
topic Communication
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8001441/
https://www.ncbi.nlm.nih.gov/pubmed/33809139
http://dx.doi.org/10.3390/s21062011
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