Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

In this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibr...

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Detalles Bibliográficos
Autores principales: Liu, Changlin, He, Wenbin, Chu, Jianning, Zhang, Jianguo, Chen, Xiao, Xiao, Junfeng, Xu, Jianfeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2021
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8060384/
https://www.ncbi.nlm.nih.gov/pubmed/33881620
http://dx.doi.org/10.1186/s11671-021-03526-x

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8060384/
https://www.ncbi.nlm.nih.gov/pubmed/33881620
http://dx.doi.org/10.1186/s11671-021-03526-x

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