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Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review
Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfe...
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8065746/ https://www.ncbi.nlm.nih.gov/pubmed/33806237 http://dx.doi.org/10.3390/nano11040842 |