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A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer

A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, (3...

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Detalles Bibliográficos
Autores principales: Farshchi Yazdi, Seyed Amir Fouad, Garavaglia, Matteo, Ghisi, Aldo, Corigliano, Alberto
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8066177/
https://www.ncbi.nlm.nih.gov/pubmed/33810581
http://dx.doi.org/10.3390/mi12040361