A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer

A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, (3...

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Autores principales: Farshchi Yazdi, Seyed Amir Fouad, Garavaglia, Matteo, Ghisi, Aldo, Corigliano, Alberto
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8066177/
https://www.ncbi.nlm.nih.gov/pubmed/33810581
http://dx.doi.org/10.3390/mi12040361
_version_ 1783682513652154368
author Farshchi Yazdi, Seyed Amir Fouad
Garavaglia, Matteo
Ghisi, Aldo
Corigliano, Alberto
author_facet Farshchi Yazdi, Seyed Amir Fouad
Garavaglia, Matteo
Ghisi, Aldo
Corigliano, Alberto
author_sort Farshchi Yazdi, Seyed Amir Fouad
collection PubMed
description A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, (3) fabricated wafers with the proposed geometrical feature demonstrated an improvement for the (4) warpage with respect to the plain wafers. A benefit for curvature variation and overall shape of the (5) bonded wafers was also observed.
format Online
Article
Text
id pubmed-8066177
institution National Center for Biotechnology Information
language English
publishDate 2021
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-80661772021-04-25 A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer Farshchi Yazdi, Seyed Amir Fouad Garavaglia, Matteo Ghisi, Aldo Corigliano, Alberto Micromachines (Basel) Article A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, (3) fabricated wafers with the proposed geometrical feature demonstrated an improvement for the (4) warpage with respect to the plain wafers. A benefit for curvature variation and overall shape of the (5) bonded wafers was also observed. MDPI 2021-03-26 /pmc/articles/PMC8066177/ /pubmed/33810581 http://dx.doi.org/10.3390/mi12040361 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) ).
spellingShingle Article
Farshchi Yazdi, Seyed Amir Fouad
Garavaglia, Matteo
Ghisi, Aldo
Corigliano, Alberto
A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
title A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
title_full A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
title_fullStr A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
title_full_unstemmed A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
title_short A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
title_sort new approach for the control and reduction of warpage and residual stresses in bonded wafer
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8066177/
https://www.ncbi.nlm.nih.gov/pubmed/33810581
http://dx.doi.org/10.3390/mi12040361
work_keys_str_mv AT farshchiyazdiseyedamirfouad anewapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer
AT garavagliamatteo anewapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer
AT ghisialdo anewapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer
AT coriglianoalberto anewapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer
AT farshchiyazdiseyedamirfouad newapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer
AT garavagliamatteo newapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer
AT ghisialdo newapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer
AT coriglianoalberto newapproachforthecontrolandreductionofwarpageandresidualstressesinbondedwafer

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