A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of...

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Detalles Bibliográficos
Autor principal: Yan, Jianfeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8067356/
https://www.ncbi.nlm.nih.gov/pubmed/33917295
http://dx.doi.org/10.3390/nano11040927

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8067356/
https://www.ncbi.nlm.nih.gov/pubmed/33917295
http://dx.doi.org/10.3390/nano11040927

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