A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

With the development of microelectronic devices having miniaturized and integrated electronic components, an efficient thermal management system with lightweight materials, which have outstanding thermal conductivity and processability, is becoming increasingly important. Recently, the use of polyme...

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Detalles Bibliográficos
Autores principales: Kwon, Yeon-Ju, Park, Jung-Bin, Jeon, Young-Pyo, Hong, Jin-Yong, Park, Ho-Seok, Lee, Jea-Uk
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8072987/
https://www.ncbi.nlm.nih.gov/pubmed/33923627
http://dx.doi.org/10.3390/polym13081312

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8072987/
https://www.ncbi.nlm.nih.gov/pubmed/33923627
http://dx.doi.org/10.3390/polym13081312

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