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Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model
The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile proper...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8125148/ https://www.ncbi.nlm.nih.gov/pubmed/33946308 http://dx.doi.org/10.3390/ma14092335 |