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Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile proper...

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Detalles Bibliográficos
Autores principales:	Qiu, Jialong, Peng, Yanzhi, Gao, Peng, Li, Caiju
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8125148/ https://www.ncbi.nlm.nih.gov/pubmed/33946308 http://dx.doi.org/10.3390/ma14092335

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