Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

This paper reported the enhancement in thermo-mechanical properties and chemical stability of porous SiCOH dielectric thin films fabricated with molecularly scaled pores of uniform size and distribution. The resulting porous dielectric thin films were found to exhibit far stronger resistance to ther...

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Detalles Bibliográficos
Autores principales: Sa, Y. K., Bang, Junghwan, Son, Junhyuk, Yu, Dong-Yurl, Kim, Yun-Chan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8125368/
https://www.ncbi.nlm.nih.gov/pubmed/33925006
http://dx.doi.org/10.3390/ma14092284

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8125368/
https://www.ncbi.nlm.nih.gov/pubmed/33925006
http://dx.doi.org/10.3390/ma14092284

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