Investigation of the thermal tolerance of silicon-based lateral spin valves

Improvement in the thermal tolerance of Si-based spin devices is realized by employing thermally stable nonmagnetic (NM) electrodes. For Au/Ta/Al electrodes, intermixing between Al atoms and Au atoms occurs at approximately 300 °C, resulting in the formation of a Au/Si interface. The Au–Si liquid ph...

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Detalles Bibliográficos
Autores principales: Yamashita, N., Lee, S., Ohshima, R., Shigematsu, E., Koike, H., Suzuki, Y., Miwa, S., Goto, M., Ando, Y., Shiraishi, M.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8134573/
https://www.ncbi.nlm.nih.gov/pubmed/34012009
http://dx.doi.org/10.1038/s41598-021-90114-9

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8134573/
https://www.ncbi.nlm.nih.gov/pubmed/34012009
http://dx.doi.org/10.1038/s41598-021-90114-9

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