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Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures

The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor....

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Detalles Bibliográficos
Autores principales: Wu, Zhenhua, Zhang, Shuai, Liu, Zekun, Lu, Cheng, Hu, Zhiyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8145968/
https://www.ncbi.nlm.nih.gov/pubmed/33922193
http://dx.doi.org/10.3390/mi12050480