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Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures
The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor....
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8145968/ https://www.ncbi.nlm.nih.gov/pubmed/33922193 http://dx.doi.org/10.3390/mi12050480 |
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author | Wu, Zhenhua Zhang, Shuai Liu, Zekun Lu, Cheng Hu, Zhiyu |
author_facet | Wu, Zhenhua Zhang, Shuai Liu, Zekun Lu, Cheng Hu, Zhiyu |
author_sort | Wu, Zhenhua |
collection | PubMed |
description | The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor. The introducing metals can be alloyed with Bi(2)Te(3) or form interstitials or dopants to adjust the carrier concentration and mobility. In addition, the metal-semiconductor interface as well as the metal-insulator-semiconductor interface constructed by the introduced metal and Al(2)O(3) would further participate in the regulation of the carrier transport process. By adjusting the metal and oxide layer, it is possible to realize the simultaneous optimization of electric conductivity and Seebeck coefficient. This work will enable the optimal and novel design of heterostructures for thermoelectric materials with further improved performance. |
format | Online Article Text |
id | pubmed-8145968 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-81459682021-05-26 Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures Wu, Zhenhua Zhang, Shuai Liu, Zekun Lu, Cheng Hu, Zhiyu Micromachines (Basel) Article The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor. The introducing metals can be alloyed with Bi(2)Te(3) or form interstitials or dopants to adjust the carrier concentration and mobility. In addition, the metal-semiconductor interface as well as the metal-insulator-semiconductor interface constructed by the introduced metal and Al(2)O(3) would further participate in the regulation of the carrier transport process. By adjusting the metal and oxide layer, it is possible to realize the simultaneous optimization of electric conductivity and Seebeck coefficient. This work will enable the optimal and novel design of heterostructures for thermoelectric materials with further improved performance. MDPI 2021-04-22 /pmc/articles/PMC8145968/ /pubmed/33922193 http://dx.doi.org/10.3390/mi12050480 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Wu, Zhenhua Zhang, Shuai Liu, Zekun Lu, Cheng Hu, Zhiyu Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures |
title | Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures |
title_full | Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures |
title_fullStr | Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures |
title_full_unstemmed | Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures |
title_short | Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures |
title_sort | bottom-up (cu, ag, au)/al(2)o(3)/bi(2)te(3) assembled thermoelectric heterostructures |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8145968/ https://www.ncbi.nlm.nih.gov/pubmed/33922193 http://dx.doi.org/10.3390/mi12050480 |
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