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Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures

The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor....

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Detalles Bibliográficos
Autores principales: Wu, Zhenhua, Zhang, Shuai, Liu, Zekun, Lu, Cheng, Hu, Zhiyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8145968/
https://www.ncbi.nlm.nih.gov/pubmed/33922193
http://dx.doi.org/10.3390/mi12050480
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author Wu, Zhenhua
Zhang, Shuai
Liu, Zekun
Lu, Cheng
Hu, Zhiyu
author_facet Wu, Zhenhua
Zhang, Shuai
Liu, Zekun
Lu, Cheng
Hu, Zhiyu
author_sort Wu, Zhenhua
collection PubMed
description The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor. The introducing metals can be alloyed with Bi(2)Te(3) or form interstitials or dopants to adjust the carrier concentration and mobility. In addition, the metal-semiconductor interface as well as the metal-insulator-semiconductor interface constructed by the introduced metal and Al(2)O(3) would further participate in the regulation of the carrier transport process. By adjusting the metal and oxide layer, it is possible to realize the simultaneous optimization of electric conductivity and Seebeck coefficient. This work will enable the optimal and novel design of heterostructures for thermoelectric materials with further improved performance.
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spelling pubmed-81459682021-05-26 Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures Wu, Zhenhua Zhang, Shuai Liu, Zekun Lu, Cheng Hu, Zhiyu Micromachines (Basel) Article The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor. The introducing metals can be alloyed with Bi(2)Te(3) or form interstitials or dopants to adjust the carrier concentration and mobility. In addition, the metal-semiconductor interface as well as the metal-insulator-semiconductor interface constructed by the introduced metal and Al(2)O(3) would further participate in the regulation of the carrier transport process. By adjusting the metal and oxide layer, it is possible to realize the simultaneous optimization of electric conductivity and Seebeck coefficient. This work will enable the optimal and novel design of heterostructures for thermoelectric materials with further improved performance. MDPI 2021-04-22 /pmc/articles/PMC8145968/ /pubmed/33922193 http://dx.doi.org/10.3390/mi12050480 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Wu, Zhenhua
Zhang, Shuai
Liu, Zekun
Lu, Cheng
Hu, Zhiyu
Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures
title Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures
title_full Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures
title_fullStr Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures
title_full_unstemmed Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures
title_short Bottom-Up (Cu, Ag, Au)/Al(2)O(3)/Bi(2)Te(3) Assembled Thermoelectric Heterostructures
title_sort bottom-up (cu, ag, au)/al(2)o(3)/bi(2)te(3) assembled thermoelectric heterostructures
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8145968/
https://www.ncbi.nlm.nih.gov/pubmed/33922193
http://dx.doi.org/10.3390/mi12050480
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