Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)

Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical research. While guaranteeing high aspect ratio str...

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Detalles Bibliográficos
Autores principales: Gerlt, Michael S., Läubli, Nino F., Manser, Michel, Nelson, Bradley J., Dual, Jürg
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8150727/
https://www.ncbi.nlm.nih.gov/pubmed/34068670
http://dx.doi.org/10.3390/mi12050542

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8150727/
https://www.ncbi.nlm.nih.gov/pubmed/34068670
http://dx.doi.org/10.3390/mi12050542

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