Fabrication of Flexible Electrode with Sub-Tenth Micron Thickness Using Heat-Induced Peelable Pressure-Sensitive Adhesive Containing Amide Groups

In response to the increasing demand for flexible devices, there is increasing effort to manufacture flexible electrodes. However, the difficulty of handling a thin film is an obstacle to the production of flexible electrodes. In this study, a heat-induced peelable pressure-sensitive adhesive (h-PSA...

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Detalles Bibliográficos
Autores principales: Shin, Hyebeom, Yang, Eunseong, Kim, Yong-Hoon, Kwak, Min-Gi, Kim, Youngmin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8150947/
https://www.ncbi.nlm.nih.gov/pubmed/34068588
http://dx.doi.org/10.3390/nano11051250

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8150947/
https://www.ncbi.nlm.nih.gov/pubmed/34068588
http://dx.doi.org/10.3390/nano11051250

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