Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization

Advanced microsystems widely used in integrated optoelectronic devices, energy harvesting components, and microfluidic lab-on-chips require high-aspect silicon microstructures with a precisely controlled profile. Such microstructures can be fabricated using the Bosch process, which is a key process...

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Detalles Bibliográficos
Autores principales: Baklykov, Dmitry A., Andronic, Mihail, Sorokina, Olga S., Avdeev, Sergey S., Buzaverov, Kirill A., Ryzhikov, Ilya A., Rodionov, Ilya A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8151951/
https://www.ncbi.nlm.nih.gov/pubmed/34066851
http://dx.doi.org/10.3390/mi12050534

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8151951/
https://www.ncbi.nlm.nih.gov/pubmed/34066851
http://dx.doi.org/10.3390/mi12050534

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