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Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization
Advanced microsystems widely used in integrated optoelectronic devices, energy harvesting components, and microfluidic lab-on-chips require high-aspect silicon microstructures with a precisely controlled profile. Such microstructures can be fabricated using the Bosch process, which is a key process...
Autores principales: | Baklykov, Dmitry A., Andronic, Mihail, Sorokina, Olga S., Avdeev, Sergey S., Buzaverov, Kirill A., Ryzhikov, Ilya A., Rodionov, Ilya A. |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8151951/ https://www.ncbi.nlm.nih.gov/pubmed/34066851 http://dx.doi.org/10.3390/mi12050534 |
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