Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer

Diamond-incorporated copper metal matrix layers were fabricated on brass substrates by using electrodeposition technology in this study. To improve the adhesion of the composite coatings on the brass substrate, a plated copper was applied as the interlayer between the multilayers and the substrate....

Descripción completa

Detalles Bibliográficos
Autores principales: Wang, Xiaoli, Chou, Chau-Chang, Wu, Liberty Tse-Shu, Wu, Rudder, Lee, Jyh-Wei, Chang, Horng-Yi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8156921/
https://www.ncbi.nlm.nih.gov/pubmed/34063425
http://dx.doi.org/10.3390/ma14102571

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8156921/
https://www.ncbi.nlm.nih.gov/pubmed/34063425
http://dx.doi.org/10.3390/ma14102571

Ejemplares similares