Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions

An InP substrate was directly bonded on a diamond heat spreader for efficient heat dissipation. The InP surface activated by oxygen plasma and the diamond surface cleaned with an NH(3)/H(2)O(2) mixture were contacted under atmospheric conditions. Subsequently, the InP/diamond specimen was annealed a...

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Detalles Bibliográficos
Autores principales: Matsumae, Takashi, Takigawa, Ryo, Kurashima, Yuichi, Takagi, Hideki, Higurashi, Eiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8159945/
https://www.ncbi.nlm.nih.gov/pubmed/34045611
http://dx.doi.org/10.1038/s41598-021-90634-4

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8159945/
https://www.ncbi.nlm.nih.gov/pubmed/34045611
http://dx.doi.org/10.1038/s41598-021-90634-4

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