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Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions
An InP substrate was directly bonded on a diamond heat spreader for efficient heat dissipation. The InP surface activated by oxygen plasma and the diamond surface cleaned with an NH(3)/H(2)O(2) mixture were contacted under atmospheric conditions. Subsequently, the InP/diamond specimen was annealed a...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8159945/ https://www.ncbi.nlm.nih.gov/pubmed/34045611 http://dx.doi.org/10.1038/s41598-021-90634-4 |