Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this stu...

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Detalles Bibliográficos
Autores principales: Mora, Mario, Amaveda, Hippolyte, Porta-Velilla, Luis, de la Fuente, Germán F., Martínez, Elena, Angurel, Luis A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8197336/
https://www.ncbi.nlm.nih.gov/pubmed/34074069
http://dx.doi.org/10.3390/polym13111721

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8197336/
https://www.ncbi.nlm.nih.gov/pubmed/34074069
http://dx.doi.org/10.3390/polym13111721

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