Cargando…
Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications
The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this stu...
Autores principales: | Mora, Mario, Amaveda, Hippolyte, Porta-Velilla, Luis, de la Fuente, Germán F., Martínez, Elena, Angurel, Luis A. |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8197336/ https://www.ncbi.nlm.nih.gov/pubmed/34074069 http://dx.doi.org/10.3390/polym13111721 |
Ejemplares similares
-
Use of Green Fs Lasers to Generate a Superhydrophobic Behavior in the Surface of Wind Turbine Blades
por: Rivera-Sahún, Joaquín, et al.
Publicado: (2022) -
Toughness amplification in copper/epoxy joints through pulsed laser micro-machined interface heterogeneities
por: Hernandez, Edwin, et al.
Publicado: (2017) -
Synthesis of copper nano/microparticles via thermal decomposition and their conversion to copper oxide film
por: ALLAHVERDİ, Çağdaş
Publicado: (2023) -
Highly Regular Hexagonally-Arranged Nanostructures on Ni-W Alloy Tapes upon Irradiation with Ultrashort UV Laser Pulses
por: Porta-Velilla, Luis, et al.
Publicado: (2022) -
Hormesis Effects of Nano- and Micro-sized Copper Oxide
por: Keshavarzi, Majid, et al.
Publicado: (2019)