Computational Study on Surface Bonding Based on Nanocone Arrays

Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechani...

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Detalles Bibliográficos
Autores principales: Song, Xiaohui, Wu, Shunli, Zhang, Rui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8224335/
https://www.ncbi.nlm.nih.gov/pubmed/34064263
http://dx.doi.org/10.3390/nano11061369

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8224335/
https://www.ncbi.nlm.nih.gov/pubmed/34064263
http://dx.doi.org/10.3390/nano11061369

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