Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usuall...

Descripción completa

Detalles Bibliográficos
Autores principales: Qi, Hao-ran, Shen, Deng-xiong, Jia, Yan-jiang, An, Yuan-cheng, Wu, Hao, Wei, Xin-ying, Zhang, Yan, Zhi, Xin-xin, Liu, Jin-gang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8227671/
https://www.ncbi.nlm.nih.gov/pubmed/34207676
http://dx.doi.org/10.3390/nano11061525

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8227671/
https://www.ncbi.nlm.nih.gov/pubmed/34207676
http://dx.doi.org/10.3390/nano11061525

Ejemplares similares