Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology

The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An ind...

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Detalles Bibliográficos
Autores principales: Zhou, Hongyu, Li, Yaqiang, Wang, Huimin, Ran, Minrui, Tong, Zhi, Zhang, Weidong, Liu, Junyou, Zheng, Wenyue
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8230396/
https://www.ncbi.nlm.nih.gov/pubmed/34200780
http://dx.doi.org/10.3390/ma14123205

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8230396/
https://www.ncbi.nlm.nih.gov/pubmed/34200780
http://dx.doi.org/10.3390/ma14123205

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