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Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology
The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An ind...
| Autores principales: | , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8230396/ https://www.ncbi.nlm.nih.gov/pubmed/34200780 http://dx.doi.org/10.3390/ma14123205 |